Three-Dimensional Molded Interconnect Devices (3D-Mid) - Jorg Franke - Grāmatas - Hanser Publications - 9781569905517 - 2014. gada 30. aprīlis
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Three-Dimensional Molded Interconnect Devices (3D-Mid)


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Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.


356 pages

Mediji Grāmatas     Book
Izlaists 2014. gada 30. aprīlis
ISBN13 9781569905517
Izdevēji Hanser Publications
Lapas 356
Izmēri 174 × 246 × 25 mm   ·   1 kg
Redaktors Franke, Jorg

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