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IC Interconnect Analysis Mustafa Celik Softcover reprint of the original 1st ed. 2002 edition
IC Interconnect Analysis
Mustafa Celik
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
320 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2013. gada 23. marts |
| ISBN13 | 9781475776744 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 310 |
| Izmēri | 155 × 235 × 17 mm · 453 g |
| Valoda | Angļu |