Pastāsti draugiem par šo preci:
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology Christopher Lyle Borst Softcover reprint of the original 1st ed. 2002 edition
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Christopher Lyle Borst
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.
243 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2014. gada 23. februāris |
| ISBN13 | 9781461354246 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 229 |
| Izmēri | 155 × 235 × 13 mm · 353 g |
| Valoda | Angļu |
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim