Pastāsti draugiem par šo preci:
Advances in CMP Polishing Technologies Toshiro Doi
Cena
€ 216,99
Pasūtīts no attālās noliktavas
Paredzamā piegāde . gada 3. - 17. aug.
Saņemiet paziņojumus par jauniem Toshiro Doi izdevumiem
Mūsu klienti saka:
Pievienot savam iMusic vēlmju sarakstam
Advances in CMP Polishing Technologies
Toshiro Doi
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
330 pages, 1, black & white illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2011. gada 6. decembris |
| ISBN13 | 9781437778595 |
| Izdevēji | William Andrew Publishing |
| Lapas | 328 |
| Izmēri | 160 × 239 × 23 mm · 544 g |
| Valoda | Angļu |
| Redaktors | Doi, Toshiro (Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan) |
| Redaktors | Kurokawa, Syuhei |
| Redaktors | Marinescu, Ioan D. (Professor and Director, Precision Micromachining Center, The University of Toledo, Toledo, OH, USA) |
