Pastāsti draugiem par šo preci:
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Erdogan Madenci 2003 Edition
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science
Erdogan Madenci
Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
205 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2002. gada 31. decembris |
| ISBN13 | 9781402073304 |
| Izdevēji | Kluwer Academic Publishers |
| Lapas | 205 |
| Izmēri | 156 × 234 × 12 mm · 489 g |
| Valoda | Angļu |
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim