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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices Suhir, Ephraim (Portland State University, Portland, USA) 1. izdevums
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Suhir, Ephraim (Portland State University, Portland, USA)
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
344 pages, 49 Tables, black and white; 75 Illustrations, black and white
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2021. gada 28. janvāris |
| ISBN13 | 9781138624733 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 382 |
| Izmēri | 241 × 167 × 31 mm · 754 g |
| Valoda | Angļu |
