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RF and Microwave Integrated Circuit Development: Technology, Packaging and Testing Patrice Gamand
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RF and Microwave Integrated Circuit Development: Technology, Packaging and Testing
Patrice Gamand
RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the front-end part of a product development (system, architecture, design techniques), by providing the reader with an insight into the back-end part of product development.
380 pages
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2013. gada 20. septembris |
| ISBN13 | 9781118378915 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 380 |
| Izmēri | 150 × 210 × 22 mm · 419 g |
