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Wireless Interface Technologies for 3D IC and Module Integration Kuroda, Tadahiro (University of Tokyo)
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Wireless Interface Technologies for 3D IC and Module Integration
Kuroda, Tadahiro (University of Tokyo)
Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.
300 pages, Worked examples or Exercises
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2021. gada 30. septembris |
| ISBN13 | 9781108841214 |
| Izdevēji | Cambridge University Press |
| Lapas | 336 |
| Izmēri | 177 × 251 × 24 mm · 752 g |
| Valoda | Angļu |
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