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Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613 - MRS Proceedings
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Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613 - MRS Proceedings
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.
176 pages, black & white illustrations
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2014. gada 5. jūnijs |
| ISBN13 | 9781107413146 |
| Izdevēji | Cambridge University Press |
| Lapas | 176 |
| Izmēri | 152 × 229 × 10 mm · 375 g (Svars (aptuveni)) |
| Valoda | Angļu |
| Redaktors | Bajaj, Rajeev |
| Redaktors | Meuris, Marc |
| Redaktors | Moinpour, Mansour |
| Redaktors | Singh, Rajiv K. (University of Florida) |
