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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings
This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
358 pages, black & white illustrations
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2014. gada 5. jūnijs |
| ISBN13 | 9781107408715 |
| Izdevēji | Cambridge University Press |
| Lapas | 358 |
| Izmēri | 152 × 229 × 24 mm · 524 g |
| Valoda | Angļu |
| Redaktors | Lin, Qinghuang (IBM T J Watson Research Center, New York) |
| Redaktors | Ryan, E. Todd |
| Redaktors | Wu, Wen-li (National Institute of Standards and Technology, Maryland) |
| Redaktors | Yoon, Do Yeung (Seoul National University) |
