Pastāsti draugiem par šo preci:
Recent Trends in VLSI and Semiconductor Packaging
Recent Trends in VLSI and Semiconductor Packaging
The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2025. gada 6. maijs |
| ISBN13 | 9781041017875 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 616 |
| Izmēri | 150 × 220 × 10 mm · 1,56 kg |
| Valoda | Angļu |
| Redaktors | Rao, K. Madhava |
| Redaktors | Reddy, T. Vasudeva |