Pastāsti draugiem par šo preci:
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Tiks izlaists | 2026. gada 20. oktobris |
| ISBN13 | 9781032959436 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 516 |
| Izmēri | 150 × 220 × 20 mm · 453 g |
| Redaktors | Shangguan, Dongkai |