Pastāsti draugiem par šo preci:
Direct Copper Interconnection for Advanced Semiconductor Technology
Direct Copper Interconnection for Advanced Semiconductor Technology
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Tiks izlaists | 2026. gada 22. maijs |
| ISBN13 | 9781032528403 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 448 |
| Izmēri | 150 × 220 × 10 mm · 850 g |
| Redaktors | Shangguan, Dongkai |