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Direct Copper Interconnection for Advanced Semiconductor Technology Dongkai Shangguan
Direct Copper Interconnection for Advanced Semiconductor Technology
Dongkai Shangguan
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
250 pages, 21 Tables, black and white; 378 Line drawings, black and white; 20 Halftones, black and w
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2024. gada 28. jūnijs |
| ISBN13 | 9781032528236 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 448 |
| Izmēri | 243 × 163 × 33 mm · 836 g |
| Valoda | Angļu |
| Redaktors | Shangguan, Dongkai |
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