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Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing Fred W. Kear 1. izdevums
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Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing
Fred W. Kear
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
296 pages, 1, black & white illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1992. gada 16. decembris |
| ISBN13 | 9780824784669 |
| Izdevēji | Taylor & Francis Inc |
| Lapas | 296 |
| Izmēri | 156 × 234 × 17 mm · 635 g |
| Valoda | Angļu |
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