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Handbook of Silicon Wafer Cleaning Technology
Werner Kern
Intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits, this handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. It covers both the process and the equipment.
660 pages, Illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2008. gada 10. janvāris |
| ISBN13 | 9780815515548 |
| Izdevēji | William Andrew Publishing |
| Lapas | 748 |
| Izmēri | 161 × 239 × 41 mm · 1,14 kg |
| Redaktors | Kern, Werner (Lam Research, San Diego, CA, USA) |
| Redaktors | Reinhardt, Karen (Cameo Consulting, San Jose, CA, USA) |
