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Physical Design for Multichip Modules - the Springer International Series in Engineering and Computer Science Mysore Sriram 1994 edition
Physical Design for Multichip Modules - the Springer International Series in Engineering and Computer Science
Mysore Sriram
Presents research work that has been conducted in the area of Multichip Module (MCM) design. This book presents an overview of the different MCM technologies. It discusses the various approaches to interconnect analysis. It also discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance.
197 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1994. gada 31. marts |
| ISBN13 | 9780792394501 |
| Izdevēji | Kluwer Academic Publishers |
| Lapas | 197 |
| Izmēri | 156 × 234 × 14 mm · 449 g |
| Valoda | Angļu |