Pastāsti draugiem par šo preci:
Benefiting from Thermal and Mechanical Simulation in Micro-electronics O De Saint Leger
Benefiting from Thermal and Mechanical Simulation in Micro-electronics
O De Saint Leger
Presents papers from the international conference on this topic, EuroSimE2000. This book discusses thermal and mechanical related problems and challenges in micro-electronics. It is useful for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
192 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2000. gada 31. decembris |
| ISBN13 | 9780792372783 |
| Izdevēji | Kluwer Academic Publishers |
| Lapas | 192 |
| Izmēri | 155 × 235 × 12 mm · 498 g |
| Valoda | Angļu |
| Redaktors | Ernst, L.j. |
| Redaktors | Leger, O.de Saint |
| Redaktors | Zhang, G.q |