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Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging Lian-Tuu Yeh
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Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging
Lian-Tuu Yeh
Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.
277 pages
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2019. gada 31. jūlijs |
| Oriģinālā izdošanas datums | 2020 |
| ISBN13 | 9780791861936 |
| Izdevēji | American Society of Mechanical Engineers |
| Lapas | 277 |
| Izmēri | 237 × 160 × 24 mm · 630 g |
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