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Integrated Circuit Failure Analysis: A Guide to Preparation Techniques - Quality and Reliability Engineering Series Beck, Friedrich (Siemens AG, Munich, Germany)
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Integrated Circuit Failure Analysis: A Guide to Preparation Techniques - Quality and Reliability Engineering Series
Beck, Friedrich (Siemens AG, Munich, Germany)
The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right.
190 pages, index
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1998. gada 19. janvāris |
| ISBN13 | 9780471974017 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 192 |
| Izmēri | 237 × 159 × 16 mm · 396 g |
| Valoda | Angļu |
