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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Pecht, Michael G. (University of Maryland, College Park, USA)
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Paredzamā piegāde . gada 27. nov. - . gada 11. dec.
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Pecht, Michael G. (University of Maryland, College Park, USA)
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals.
464 pages, bibliography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1994. gada 31. marts |
| ISBN13 | 9780471594468 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 464 |
| Izmēri | 163 × 238 × 31 mm · 839 g |
