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Quality Conformance and Qualification of Microelectronic Packages and Interconnects M Pecht
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
M Pecht
All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted.
462 pages, Illustrations
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 1994. gada 7. novembris |
| Oriģinālā izdošanas datums | 1995 |
| ISBN13 | 9780471594369 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 496 |
| Izmēri | 155 × 236 × 31 mm · 889 g |
| Redaktors | Dasgupta, Abhijit (University of Maryland, USA) |
| Redaktors | Evans, Jillian Y. (NASA Goddard Space Flight Center Facility in Greenbelt, MD, USA) |
| Redaktors | Evans, John W. (NASA Headquarters in Washington, D.C.) |
| Redaktors | Pecht, Michael G. (University of Maryland, USA) |
