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Soldering Processes and Equipment MG Pecht
Soldering Processes and Equipment
MG Pecht
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.
312 pages, Ill.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1993. gada 4. jūnijs |
| ISBN13 | 9780471591672 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 312 |
| Izmēri | 158 × 221 × 23 mm · 603 g |
| Valoda | Angļu |
| Redaktors | Pecht, Michael G. (University of Maryland, College Park) |
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