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Advanced Electronic Packaging - IEEE Press Series on Microelectronic Systems Brown 2. izdevums
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Advanced Electronic Packaging - IEEE Press Series on Microelectronic Systems
Brown
This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed. W. D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.
840 pages, illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2006. gada 23. maijs |
| ISBN13 | 9780471466093 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 848 |
| Izmēri | 264 × 190 × 51 mm · 1,73 kg |
| Valoda | Angļu |
| Redaktors | Brown, William D. (University of Arkansas) |
| Redaktors | Ulrich, Richard K. (University of Arkansas) |
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