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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China)
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China)
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
576 pages, illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2011. gada 17. maijs |
| ISBN13 | 9780470827802 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 576 |
| Izmēri | 175 × 252 × 36 mm · 1,13 kg |
| Valoda | Angļu |
