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Microelectronic Packaging - New Trends in Electrochemical Technology 1. izdevums
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Microelectronic Packaging - New Trends in Electrochemical Technology
With the advent of electrochemical processing technologies for chips metallization, there has been corresponding development of equipment compatible with semiconductor industry standards. These include high volume manufacturing tools that are
568 pages, 100 equations; 86 Halftones, black and white; 56 Tables, black and white; 387 Illustratio
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2004. gada 20. decembris |
| ISBN13 | 9780415311908 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 564 |
| Izmēri | 150 × 220 × 20 mm · 1,21 kg |
| Valoda | Angļu |
| Redaktors | Datta, M. (Cooligy, Inc., Mountain View, California, USA) |
| Redaktors | Osaka, Tetsuya (University of Tokyo, Japan) |
| Redaktors | Schultze, J. Walter (Heinrich Heine Universit¿t, D¿sseldorf, Germany) |
