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Physical Design for 3D Integrated Circuits - Devices, Circuits, and Systems 1. izdevums
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Physical Design for 3D Integrated Circuits - Devices, Circuits, and Systems
This book reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look a
397 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2021. gada 31. marts |
| ISBN13 | 9780367778873 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 416 |
| Izmēri | 150 × 220 × 10 mm · 453 g |
| Valoda | Angļu |
| Redaktors | Tan, Chuan Seng (Nanyang Technological University, Singapore) |
| Redaktors | Todri-Sanial, Aida (CNRS-LIRMM / University of Montpellier, France) |
