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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices Suhir, Ephraim (Portland State University, Portland, USA)
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Suhir, Ephraim (Portland State University, Portland, USA)
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
382 pages, 49 Tables, black and white; 75 Illustrations, black and white
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2024. gada 4. oktobris |
| ISBN13 | 9780367635886 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 382 |
| Izmēri | 150 × 220 × 10 mm · 453 g |
| Valoda | Angļu |
