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Through Silicon Vias: Materials, Models, Design, and Performance Brajesh Kumar Kaushik 1. izdevums
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Through Silicon Vias: Materials, Models, Design, and Performance
Brajesh Kumar Kaushik
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
216 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2020. gada 30. jūnijs |
| ISBN13 | 9780367574543 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 216 |
| Izmēri | 150 × 220 × 10 mm · 453 g |
| Valoda | Angļu |
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