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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Xing-Chang Wei 1. izdevums
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power
322 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2020. gada 30. jūnijs |
| ISBN13 | 9780367573669 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 322 |
| Izmēri | 150 × 220 × 10 mm · 453 g |
| Valoda | Angļu |
