Pastāsti draugiem par šo preci:
Advances in Chemical Mechanical Planarization (CMP) - Woodhead Publishing Series in Electronic and Optical Materials 2. izdevums
Advances in Chemical Mechanical Planarization (CMP) - Woodhead Publishing Series in Electronic and Optical Materials
600 pages, Approx. 200 illustrations (150 in full color); Illustrations, unspecified
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2021. gada 16. septembris |
| ISBN13 | 9780128217917 |
| Izdevēji | Elsevier Science Publishing Co Inc |
| Lapas | 648 |
| Izmēri | 150 × 220 × 10 mm · 857 g |
| Redaktors | Suryadevara, Babu (Clarkson University, Potsdam, NY, USA) |