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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) 2. izdevums
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Paredzamā piegāde . gada 30. okt. - . gada 13. nov.
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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications
Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)
498 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2018. gada 11. oktobris |
| ISBN13 | 9780128119785 |
| Izdevēji | William Andrew Publishing |
| Lapas | 508 |
| Izmēri | 151 × 229 × 24 mm · 675 g |
| Valoda | Angļu |
| Sērijas redaktors | Licari, James J. (AvanTeco, Whittier, CA, USA) |
