Pastāsti draugiem par šo preci:
Advanced Flip Chip Packaging Softcover reprint of the original 1st ed. 2013 edition
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
560 pages, 37 Tables, black and white; VII, 560 p.
| Mediji | Grāmatas Book |
| Izlaists | 2016. gada 23. augusts |
| ISBN13 | 9781489979339 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 560 |
| Izmēri | 234 × 157 × 32 mm · 953 g |
| Valoda | Angļu |
| Redaktors | Lai, Yi-Shao |
| Redaktors | Tong, Ho-Ming |
| Redaktors | Wong, C.P. |